Wafer Level Chip Scale Packaging-WLCSP-NEXTECK

WLCSP

Wafer Level Chip Scale Packaging (WLCSP), is a method of the wafer packaging.
Opposite with the traditional packaging method-package testing after dicing which increases at least 20% of the chip volume after packaging; WLCSP packs and tests the whole wafer first, and cuts them into each IC dies, thus, the final size of the chip is the same as the original IC wafer.
Applications

· Bluetooth/Wi-Fi
· GPS
· FM Radio
· Camera
· Cell Phones and System Boards
· Analog Devices

· Power Amplifier
· Power supply
· RF Devices
· Mini LED
· Tiny component
· Optoelectronic device

Features:
The material of product is a PC carrier tape.
1. Static dissipation, which protects static sensitive components.
2. The material will not break when bent.
3. Small burrs (<20μm), High precision.
4. Size stability.

Product Features

• THERMO SHEET EC - Electrical conductivity with carbon black, PS & PC based grades available, 3 layers with stable electrical conductivity.

• THERMO FILM - Cover tape film, PS, PC, PEC, PVC. Excellent sealing for heat-seal embossed carrier tapes, good peeling characteristics.

• ELEGRIP TAPE (Back Grinding Tape) - Protect the circuit surface “r”, excellent adhesion to uneven wafer surfaces on the circuit side, effective control of particles.

• ELEGRIP TAPE (Dicing Tape) - Excellent control to back-side chipping fly-off, excellent over-time stability (T Series), excellent adhesiveness (shape-following properties), excellent expandability peeling.

Services Info

Our Products

WLCSP

Product Features

DENKA Cover Tape

DENKA Dicing Tape

DENKA Thermal Sheet

Our Products

Cover Tape

Thermo Film

DICING TAPE

BACK GRINDING TAPE

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